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Integrated circuit packaging
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11	Leti’s Silicon Photonics-based solutions for Optical Communications Supporting you from design to prototyping of devices, integrated circuits and packaging solutions. Supporting you in setting up your supply chain. Add to Reading List Source URL: www-leti.cea.fr Language: English - Date: 2015-05-22 05:05:44 Physics Silicon photonics Integrated circuit Optical fiber Photonic Chip Laser Photonic integrated circuit Hybrid silicon laser Optics Photonics Electromagnetic radiation
12	Miniaturization – A paradigm shift in advanced manufacturing and education Tai-Ran Hsu, Ph.D. ASME Fellow and Member of IEEE Microsystems Design and Packaging Laboratory Department of Mechanical and Aerospace Enginee Add to Reading List Source URL: www.engr.sjsu.edu Language: English - Date: 2007-08-02 13:38:44** Nanotechnology Science Microelectromechanical systems Miniaturization Microfabrication Nanoelectromechanical system RF MEMS Integrated circuit Microsystem Technology Materials science Microtechnology
13	micronanofabricacion_centro_tecnologia_nanofotonica Add to Reading List Source URL: www.ntc.upv.es Language: English - Date: 2013-11-13 07:51:42 Microtechnology Flip chip Micro-Opto-Electro-Mechanical Systems Integrated circuit packaging Microelectromechanical systems Solder Wire bonding Integrated circuit Nanophotonics Semiconductor device fabrication Materials science Technology
14	WORKSHOPS AND SHORT COURSES Add to Reading List Source URL: www.eumweek.com Language: English - Date: 2015-04-22 10:49:33 Integrated circuits Semiconductor device fabrication Multi-chip module Three-dimensional integrated circuit Electronic design Monolithic microwave integrated circuit Electronic packaging Electronic design automation Electronics Electronic engineering Technology
15	Project result CT302 I Towards one European test solution [TOETS] A testing dilemma As semiconductor chip Add to Reading List Source URL: www.aeneas-office.eu Language: English - Date: 2014-07-21 10:33:01 Integrated circuits Design for X Semiconductor device fabrication Packaging Reliability engineering Survival analysis Built-in self-test Application-specific integrated circuit NXP Semiconductors Technology Electronic engineering Design
16	FOR IMMEDIATE RELEASE FOWLP is now entering a new era …SPTS Technologies, an Orbotech company, interviewed by Yole Développement’s analysts LYON, France –May 6, 2015 – Fan-Out Wafer Level Packaging is now enteri Add to Reading List Source URL: www.yole.fr Language: English - Date: 2015-05-06 04:31:30 Technology Orbotech Microelectromechanical systems Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Wafer TSMC Semiconductor fabrication plant Semiconductor device fabrication Materials science Microtechnology
17	Cooperation between Cypak and DELTA Smart, secure and connected Cypak and DELTA put the intelligence into pharmaceutical packaging Imagine intelligent packaging that reminds you to take a pill, that stores your feedbac Add to Reading List Source URL: www.madebydelta.com Language: English - Date: 2009-05-25 03:49:01 Packaging and labeling Active packaging Radio-frequency identification Technology Packaging Application-specific integrated circuit
18	Chapter 5.1 General provisionsApplication and general provisions This Part sets forth the provisions for dangerous goods consignments relative to marking, labelling, and Add to Reading List Source URL: www.otif.org Language: English - Date: 2010-11-25 05:39:52 Industrial design Packaging and labeling Retailing Debian Label Integrated circuit packaging Technology Business Industrial engineering
19	Surface Mount (SMD) Packaging Add to Reading List Source URL: diodes.com Language: English - Date: 2015-05-08 16:34:09 Small-outline integrated circuit Na Na Na Electronics manufacturing Electronic design Surface-mount technology
20	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology

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